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Electronic board analysis

  • Macroscopic examination according to IPC standards
  • PCB verification according to IPC standards (welded joints, metallized holes, laminates, etc.) by microscopic examination in section of the embedded sample
  • Surface SEM-EDS analysis for semi-quantitative chemical analysis (coatings, blackpads, corrosion, pollutants, etc.)
  • Traction detachment of a component
  • Shear test (detachment test with side load)
  • Radiography (RT)
  • Environmental reliability tests and product life cycle tests
  • Preparation of the embedded sample
  • Evaluation of the intermetallic and measurement of its thickness by microscopic examination in section of the embedded sample
  • C-SAM analysis (acoustic microscopy) to verify defects inside the component (eg delaminations)
  • Traction test on PIN (N ° 3 PIN)
  • Computerized industrial tomography (CT)
  • Verification of compliance with the RoHS directive
  • Shock and vibration tests and fall tests